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Samsung allocates half of 4nm capacity to HBM4 base die production

September 7, 2026, 08:24 UTC · Hwaseong, South Korea · Asia-Pacific · no longer in the live window

Samsung Electronics has dedicated approximately 50% of its 4nm semiconductor capacity to manufacturing base dies for HBM4 memory chips in response to AI-driven demand.

This page was generated automatically by TechMap Live from a public news report published by cnBeta. Coordinates and impact level are estimates — an event is usually pinned at a company's headquarters or launch site. This is an aggregation of news coverage, not original reporting — read the original report before relying on it.

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