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Xiaomi unveils 18‑Fold smartphone with XRing O3 chip at IFA 2026

· Berlin, Germany · Europe · no longer in the live window

Xiaomi showcased its 18‑Fold foldable phone powered by the XRing O3 chip and LPDDR6 memory at the IFA 2026 trade show.

Topic
Software & apps
Location
Berlin, Germany (52.520°, 13.405°)
Region
Europe
Impact
medium
Reported by
Digiato
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